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KLMBG2JETD-B041

MPN: KLMBG2JETD-B041

✅ RoHS 2.0 📦 Traceable 🛡 Genuine

KLMBG2JETD-B041

32GB eMMC 5.1

Category Memory & Storage
Subcategory Memory & Storage
Brand Samsung
Compliance RoHS 2.0
Application Embedded system memory / storage
Stock In Stock
Overview   The KLMBG2JETD-B041 is Samsung’s 32GB eMMC 5.1 embedded storage device, integrating the NAND array and an eMMC controller in a single 153-ball FBGA package (11.5 × 13 mm). The controller handles bad-block management, wear levelling and ECC, so the host side needs no NAND management layer of its own — the shortest development path when migrating away from raw NAND. HS400 mode is supported, giving up to 400 MB/s of bus bandwidth on the 8-bit data bus; against the 200 MB/s of HS200 the difference shows clearly in boot time and large sequential writes. Revision 5.1 adds Command Queuing and Cache Barrier over 5.0, improving random IOPS.     Specification  
Parameter Value
Manufacturer Samsung
Part number KLMBG2JETD-B041
Product family eMMC embedded storage
Density 32GB
Standard JEDEC eMMC 5.1
Interface 8-bit parallel, HS400 / HS200 / DDR52 compatible
Bus bandwidth Up to 400 MB/s (HS400)
NAND type MLC
Supply voltage VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V
Operating temperature -25 °C to 85 °C
Package 153-ball FBGA, 11.5 × 13 × 1.0 mm
Compliance Lead-free, halogen-free, RoHS
Packing Tray
  Key Features
  • NAND and controller in one package; no NAND management firmware needed on the host
  • HS400 high-speed mode on an 8-bit bus, backward compatible with HS200 / DDR52 / SDR
  • eMMC 5.1 Command Queuing (CQ) and Cache Barrier for better random performance
  • Built-in ECC, bad-block management and wear levelling
  • Boot partitions, RPMB replay-protected partition, Secure Erase / Sanitize
  • HW Reset, Background Operations and Power-off Notification supported
  • Standard 153-ball FBGA footprint, pin-compatible with mainstream eMMC for multi-sourcing
  Applications
  • Android handsets, tablets and automotive infotainment head units
  • Set-top boxes, smart TVs and network media players
  • Industrial mainboards, HMI panels and edge gateways
  • Single-board computers, compute modules and embedded Linux platforms
  • Smart speakers, POS terminals and self-service kiosks
  Ordering Guide

eMMC 5.1 — commercial temperature (-25 ~ +85°C)

Part number Density Package (mm) NAND Status
KLMEG8UERM-C041 256 GB 11.5×13×1.0 3bit MLC Mass production
KLMDG4UERM-B041 128 GB 11.5×13×1.0 3bit MLC Mass production
KLMDG8JENB-B041 128 GB 11.5×13×1.2 2bit MLC Mass production
KLMCG4JETD-B041 64 GB 11.5×13×1.0 2bit MLC Mass production
KLMCG4JENB-B041 64 GB 11.5×13×1.0 2bit MLC Mass production
KLMCG2KETM-B041 64 GB 11.5×13×1.0 2bit MLC Mass production
KLMBG2JENB-B041 32 GB 11.5×13×1.0 2bit MLC Mass production
KLMBG2JETD-B041 32 GB 11.5×13×0.8 2bit MLC Mass production
KLMAG1JENB-B041 16 GB 11.5×13×0.8 2bit MLC Mass production
KLMAG1JETD-B041 16 GB 11.5×13×0.8 2bit MLC Mass production
KLM8G1GEME-B041 8 GB 11.5×13×0.8 2bit MLC Mass production
KLM8G1GETF-B041 8 GB 11.5×13×0.8 2bit MLC Mass production

eMMC 5.1 — industrial temperature (-GESD line)

Part number Density Package (mm) Temp range Status
KLMCG8GESD-B04P 64 GB 11.5×13×1.0 -40 ~ +85°C Customer sample
KLMCG8GESD-B04Q 64 GB 11.5×13×1.0 -40 ~ +105°C Customer sample
KLMBG4GESD-B04P 32 GB 11.5×13×1.0 -40 ~ +85°C Mass production
KLMBG4GESD-B04Q 32 GB 11.5×13×1.0 -40 ~ +85°C * Mass production
KLMAG2GESD-B04P 16 GB 11.5×13×0.8 -40 ~ +85°C Mass production
KLMAG2GESD-B04Q 16 GB 11.5×13×0.8 -40 ~ +105°C Mass production
KLM8G1GESD-B04P 8 GB 11.5×13×0.8 -40 ~ +85°C Mass production
KLM8G1GESD-B04Q 8 GB 11.5×13×0.8 -40 ~ +105°C Mass production