Overview
The KLMBG2JETD-B041 is Samsung’s 32GB eMMC 5.1 embedded storage device, integrating the NAND array and an eMMC controller in a single 153-ball FBGA package (11.5 × 13 mm). The controller handles bad-block management, wear levelling and ECC, so the host side needs no NAND management layer of its own — the shortest development path when migrating away from raw NAND.
HS400 mode is supported, giving up to 400 MB/s of bus bandwidth on the 8-bit data bus; against the 200 MB/s of HS200 the difference shows clearly in boot time and large sequential writes. Revision 5.1 adds Command Queuing and Cache Barrier over 5.0, improving random IOPS.
Specification
| Parameter |
Value |
| Manufacturer |
Samsung |
| Part number |
KLMBG2JETD-B041 |
| Product family |
eMMC embedded storage |
| Density |
32GB |
| Standard |
JEDEC eMMC 5.1 |
| Interface |
8-bit parallel, HS400 / HS200 / DDR52 compatible |
| Bus bandwidth |
Up to 400 MB/s (HS400) |
| NAND type |
MLC |
| Supply voltage |
VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V |
| Operating temperature |
-25 °C to 85 °C |
| Package |
153-ball FBGA, 11.5 × 13 × 1.0 mm |
| Compliance |
Lead-free, halogen-free, RoHS |
| Packing |
Tray |
Key Features
- NAND and controller in one package; no NAND management firmware needed on the host
- HS400 high-speed mode on an 8-bit bus, backward compatible with HS200 / DDR52 / SDR
- eMMC 5.1 Command Queuing (CQ) and Cache Barrier for better random performance
- Built-in ECC, bad-block management and wear levelling
- Boot partitions, RPMB replay-protected partition, Secure Erase / Sanitize
- HW Reset, Background Operations and Power-off Notification supported
- Standard 153-ball FBGA footprint, pin-compatible with mainstream eMMC for multi-sourcing
Applications
- Android handsets, tablets and automotive infotainment head units
- Set-top boxes, smart TVs and network media players
- Industrial mainboards, HMI panels and edge gateways
- Single-board computers, compute modules and embedded Linux platforms
- Smart speakers, POS terminals and self-service kiosks
Ordering Guide
eMMC 5.1 — commercial temperature (-25 ~ +85°C)
| Part number |
Density |
Package (mm) |
NAND |
Status |
| KLMEG8UERM-C041 |
256 GB |
11.5×13×1.0 |
3bit MLC |
Mass production |
| KLMDG4UERM-B041 |
128 GB |
11.5×13×1.0 |
3bit MLC |
Mass production |
| KLMDG8JENB-B041 |
128 GB |
11.5×13×1.2 |
2bit MLC |
Mass production |
| KLMCG4JETD-B041 |
64 GB |
11.5×13×1.0 |
2bit MLC |
Mass production |
| KLMCG4JENB-B041 |
64 GB |
11.5×13×1.0 |
2bit MLC |
Mass production |
| KLMCG2KETM-B041 |
64 GB |
11.5×13×1.0 |
2bit MLC |
Mass production |
| KLMBG2JENB-B041 |
32 GB |
11.5×13×1.0 |
2bit MLC |
Mass production |
| KLMBG2JETD-B041 |
32 GB |
11.5×13×0.8 |
2bit MLC |
Mass production |
| KLMAG1JENB-B041 |
16 GB |
11.5×13×0.8 |
2bit MLC |
Mass production |
| KLMAG1JETD-B041 |
16 GB |
11.5×13×0.8 |
2bit MLC |
Mass production |
| KLM8G1GEME-B041 |
8 GB |
11.5×13×0.8 |
2bit MLC |
Mass production |
| KLM8G1GETF-B041 |
8 GB |
11.5×13×0.8 |
2bit MLC |
Mass production |
eMMC 5.1 — industrial temperature (-GESD line)
| Part number |
Density |
Package (mm) |
Temp range |
Status |
| KLMCG8GESD-B04P |
64 GB |
11.5×13×1.0 |
-40 ~ +85°C |
Customer sample |
| KLMCG8GESD-B04Q |
64 GB |
11.5×13×1.0 |
-40 ~ +105°C |
Customer sample |
| KLMBG4GESD-B04P |
32 GB |
11.5×13×1.0 |
-40 ~ +85°C |
Mass production |
| KLMBG4GESD-B04Q |
32 GB |
11.5×13×1.0 |
-40 ~ +85°C * |
Mass production |
| KLMAG2GESD-B04P |
16 GB |
11.5×13×0.8 |
-40 ~ +85°C |
Mass production |
| KLMAG2GESD-B04Q |
16 GB |
11.5×13×0.8 |
-40 ~ +105°C |
Mass production |
| KLM8G1GESD-B04P |
8 GB |
11.5×13×0.8 |
-40 ~ +85°C |
Mass production |
| KLM8G1GESD-B04Q |
8 GB |
11.5×13×0.8 |
-40 ~ +105°C |
Mass production |
KLMBG2JETD-B041 Alternative Part Numbers
All part numbers listed are 153FBGA and are electrically pin-compatible with KLMBG2JETD-B041. Priority order reflects sourcing preference, not performance ranking. Confirm capacity grade, operating temperature range and firmware revision against the manufacturer datasheet before qualification.
| Brand |
Alternative Part Number |
Standard |
Package |
Verification Source |
Remarks |
| Priority 1 · Same-manufacturer alternatives (Samsung) |
| Samsung |
KLMBG1UCTC-B041 |
eMMC 5.1 |
153FBGA |
Listed as active on Samsung official site |
New-generation UCT family |
| Samsung |
KLMBG2JENB-B041 |
eMMC 5.1 |
153FBGA |
— |
— |
| Samsung |
KLMBG4GESD-B031 |
eMMC 5.0 |
153FBGA |
— |
Reduced-specification option |
| Priority 2 · Tier-1 manufacturers, pin-to-pin |
| SK hynix |
H26M52208FPR / H26M64208EMR / H26M62002JPR |
eMMC 5.1 |
153FBGA |
— |
Mainstream choice in the Chinese industrial-control and commercial-display market; high circulation |
| Micron |
MTFC32GAPALBH-IT / MTFC32GAZAQHD-IT / MTFC32GAKAECN / MTFC32GAKAEJP |
eMMC 5.1 |
153FBGA |
— |
— |
| Kioxia |
THGBMUG8C2LBA / THGAMVG8T13BA |
eMMC 5.1 |
153FBGA |
— |
— |
| SanDisk / WD |
SDINBDG4-32G / SDINBDA6-32G |
eMMC 5.1 |
153FBGA |
— |
— |
| Kingston |
EMMC32G-TS0A-01001 / EMMC32G-TX29 / EMMC32G-IX29 |
eMMC 5.1 |
153FBGA |
— |
|
| ISSI / Alliance / ESMT |
IS21TF32G-JCLI / IS21TF32G-BCLI / ASFC32G31T3-51BIN / FC51J32SJTS1A |
eMMC 5.1 |
153FBGA |
— |
— |
| Priority 3 · Domestic and second-tier suppliers |
| Biwin |
BWAMDIC21C32G |
eMMC 5.1 |
153FBGA |
— |
— |
| Foresee (Longsys) |
FSEIASLD-32G |
eMMC 5.1 |
153FBGA |
— |
— |
| Kingston / Others |
EMMC32G-M525 / TOPDISKA132-32G / EMC032TYD-X1PWA |
eMMC 5.1 |
153FBGA |
— |
— |
Substitution Checklist
- Capacity and density grade match (32GB / 8 Die).
- Operating temperature range meets the application (commercial vs industrial).
- Bus speed mode supported by the host controller (HS200 / HS400).
- Boot partition configuration and firmware revision verified.
- Sample validation completed on the target board before volume release.
